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Plasma Process Experts

Ways to Efficiency in Semiconductor Manufacturing

plasway-Technologies GmbH develops and builds process chambers and processes for Plasma Enhanced Atomic Layer Deposition (PEALD) and Atomic Layer Etching (ALE) — both in one chamber, with fully symmetric gas flow.

Precision at the atomic scale.

Explore Technology
  • Founded in 2016Focused on Plasma processes
  • 10 expertsin our Dresden team
  • PEALD & ALEin one vacuum chamber
Vacuum Chamber DevelopmentFor standard & special substrate geometries
Process DevelopmentIndustry-standard PEALD & ALE processes
Contract CoatingHigh-quality results for standard and special substrate sizes & materials
Patents & Exclusive RightsCovering vacuum chambers, components, & processes
Vacuum-Compatible PartsHigh-quality, industry-grade, customized solutions
Why plasway

Why Choose plasway?

We deliver unmatched expertise, over 30 years of experience in micro-electronics industry,cutting-edge technology, and a commitment to your success.

One Chamber, Two Processes

ALE and PEALD in situ — clean, etch and deposit without breaking vacuum, and save a tool.

Symmetric Gas Flow

Patented 3D-printed gas injection ring with roughly three times better flow uniformity.

Low-Temperature Processes

Ion-energy-assisted deposition: High quality deposition & Etching at 120 °C and below, proof of concept done.

Real-Time Control

Tool parameters monitored on a 10 ms basis via EtherCAT, with optical plasma monitoring.

Capabilities

Our Core Expertise

We at plasway-Technologies GmbH are experts in plasma processes of all kinds, especially for Atomic layer processing.

Plasma Enhanced Layer Atomic Deposition

PEALD of Al₂O₃, SiO₂, TiO₂, TiN and TaN with excellent conformality, even in high-aspect-ratio structures etc.

PEALD

Atomic Layer Etching

Ion-energy ALE for CD trimming and surface preparation, with surface roughness below 0.28 nm RMS on GaAs.

ALE

Process Development

Custom plasma process development, backed by flow-simulation analysis of reaction chambers as a core competence.

R&D

Consulting & Plasma School

Consulting in plasma processing and productivity, plus training on plasma-based etching, ALE, RIE in ICP Chambers and deposition (PECVD / PEALD).

TRAINING

Components & Spare Parts

Bipolar Electrostatic Chuck, ZrO₂ lift pins, Ceramics cover rings and customized parts that extend equipment lifetime or enable next-generation applications.

COMPONENTS

Analytics & Project Support

Analytics services and project support for semiconductor and non-semiconductor applications.

ANALYTICS
Applications

Where FALP® Delivers

In-situ ALE and PEALD open new process routes — each one saves a tool.

In-Situ Double Patterning

CD trimming, Al₂O₃ spacer deposition directly on resist at 20 °C, and etch — all in one chamber.

High Power Devices

In-situ ALE + PEALD on GaAs, GaN, AlGaN and silicon, with good electrical results.

Optical Films

Thick, high-throughput PEALD films with excellent refractive index, even on 430 mm substrates.

MEMS Passivation

Low-temperature PEALD for advanced final passivation and barrier films in high-aspect-ratio structures.

 Milestone Achieved

FALP® Tool: In-Situ Capacitor in 15 Minutes

Fully integrated in-situ processing. After startup in Q1/2022, full ALE and PEALD development on the FALP® 17″ tool took just three years. In June 2024 we showed a complete capacitor — ALE removal of the native oxide, Al₂O₃ base layer, TiN electrode and SiO₂ dielectric — in about 15 minutes.

Proven in-situ process flow Real-time 10 ms monitoring
Discover FALP®
Availability

FALP® Tools

From the running alpha tool to the planned production tool — configurations for different substrate sizes.

430mm
FALP®430 for 430 mm substrates, thick layer deposition
Running since Q1/2022
300 mm
FALP®-300 with self-developed bipolar ESC
Running Q2–2023
200 mm
FALP-200 with self developed bipolar ESC
Planned as a separate product
Our Dresden site at Gostritzer Str. 67d offers a 120 m² laboratory and over 450 m² in total — enough space for a fully automatic multi-chamber cluster tool. A second pre-alpha tool runs at Fraunhofer IKTS.
Outlook 2026/27: ion-energy-assisted PEALD & ALE research, mixed Al₂O₃ / SiO₂ / TiO₂ / TiN / TaN laminates, automation and AI integration, and a fully automatic FALP®-300 beta tool.

Join Our Team

Would you like to become part of our team? We are always interested in motivated and talented new employees. If you have the feeling that you would fit in with us and our team, please inform yourself here regularly.

Today 10 experts — 6 engineers, a mechatronics technician, a PhD student and 2 working students — cover process, electrical and mechanical engineering, nanotechnology, RF technology and finance. Led by physicist Stephan Wege, with over 30 years in semiconductor dry etch.

We focus on people — a good team is the essence of our company.

10 Experts Dresden, Germany
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Ready to Transform Your Manufacturing?

Book a consultation with our experts and discover how plasway can elevate your semiconductor production to the next level.

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