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A Timeline of Plasma Innovation

From a small Dresden cleanroom to a trusted partner for semiconductor fabs worldwide — here is how plasway-Technologies got here.

2016

Company Founded

plasway-Technologies GmbH established.

2016–2020

Process Foundation

Basic processes for the FALP® tool prepared in collaboration with Fraunhofer IKTS.

2021

Design Breakthrough

Design and simulation of FALP-430 completed; production phase began.

2022 (Feb)

New Facility & Tool Arrival

Development of a new facility started; FALP-430 arrived and FALP-300 was under construction.

2022 (May–June)

FALP-430 Qualified

FALP-430 qualified as a PEALD tool.

2022 (June) – 2023 (May)

Large-Substrate Deposition

Thick film depositions on large substrates (430mm) with <3% non-uniformity.

2023 (June–December)

FALP-300 Qualified

FALP-300 qualified as a PEALD tool with self-developed Bipolar ESC.

2024 (Jan–August)

PEALD Process Development

PEALD of SiO₂, Al₂O₃ and TiO₂ on Si and optical substrates.

2024 (Sept–Dec)

First ALE Studies

ALE of SiO₂ and testing of different materials; ion energy study conducted.

2025

Advanced Materials Testing

PEALD of TiN on very high aspect-ratio structures; ALE of GaN and testing of different materials.

2026 (Jan–March)

Bigger Facility

Moved into a bigger facility; tool requalified.

2026 (April onwards)

High-AR Etching & Cluster Tool

ALE of Si, SiO₂ and Al₂O₃ on high aspect-ratio structures; preparing for cluster tool.

About Us

People Behind plasway

A focused team of engineers and scientists in Dresden.

The plasway-Technologies team in Dresden

View LinkedIn profile Stephan Wege Managing Director (CEO)

Leadership

Stephan Wege

Managing Director (CEO)

Management 32 years of experience With plasway since September 2009

Experienced CEO with more than three decades in the semiconductor industry. A physicist by training (Diplom, TU Berlin), Stephan spent 15 years in dry etch at Infineon and Qimonda before founding plasway. He is skilled in thin films, process control, lithography, materials science and plasma etch, and leads plasway-Technologies in the development of Atomic Layer Etching and Plasma Enhanced Atomic Layer Deposition.

[email protected] +49 351 2681262

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Highlights

Inventor of the patent "Method for the Treatment of Material, in particular in the fabrication of semiconductor components"
15 years as Principal Dry Etch at Infineon Technologies and Qimonda
Diplom in Physics, Technische Universität Berlin
Founded plasway (plasma consulting) in 2009 and has led plasway-Technologies GmbH since 2015
Expertise in thin films, process control, lithography, materials science and plasma etch

Career

CEO · plasway-Technologies GmbH Dec 2015 – Present Consulting, chamber part development and distribution, plasma school and coaching, standard dry etching, Atomic Layer Etching and Plasma Enhanced Atomic Layer Deposition.
CEO · plasway (Plasma Consulting) Sep 2009 – Present Plasma consulting.
Principal Dry Etch · Qimonda 1994 – 2009 Dry etch process leadership in semiconductor manufacturing.
Principal Dry Etch · Infineon Technologies 1994 – 2009 Dry etch process leadership in semiconductor manufacturing.

Partners

Our Partners & Collaborations

Research institutes and industry partners who help us build, test and validate FALP® and our plasma processes.

Fraunhofer IKTS

Fraunhofer Institute for Ceramic Technologies and Systems in Dresden. Research partner for ceramics and process technology – a second pre-alpha FALP® tool is operated at the institute.

TU Freiberg

Technische Universität Bergakademie Freiberg, a Saxon university with a strong focus on materials science and engineering – research and academic partner.

3-5 Power Electronics

Dresden-based developer of III-V (GaN) power semiconductor devices – a partner for transistor and device applications of in-situ ALE and PEALD.

Alumina Systems

Manufacturer of technical ceramics from Saxony – supplier of high-purity ceramic components for demanding vacuum and plasma applications.

Lithoz

Pioneer in 3D printing of technical ceramics – produces the 3D-printed ceramic gas injection ring with roughly three times better flow uniformity.

FAP, Dresden

Dresden-based partner in the regional semiconductor and materials network.

IFW – Leibniz Institute, Dresden

Leibniz Institute for Solid State and Materials Research Dresden (IFW Dresden) – a research partner in solid-state and materials science.

Edwards Vacuum

Global supplier of vacuum pumps and abatement systems for semiconductor manufacturing – vacuum technology partner.

SGS Fresenius Dresden

Analytical and testing laboratory in Dresden – provides analytics and characterization services for semiconductor and materials applications.