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What We Do

From Process R&D to Production-Ready Hardware

plasway-Technologies isn't just an equipment builder. We run the coating and etch processes ourselves, measure the result down to the atomic layer, and manufacture the precision ceramic parts that make it all possible.

FALP® Systems

Turnkey combined ALE/PEALD chambers.

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Contract Coating

PEALD & ALE processes on standard wafers and specific customer materials/substrates

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Analytics

Optical emission spectroscopy, Cold plasma measurements ,Ellipsometry, AFM etc.

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Process Consulting

Recipe development & feasibility studies.

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Contract Manufacturing

ESCs, lift pins, cover rings in ceramic.

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FALP lid assembly with mounted large-diameter gas distribution ring
Equipment

FALP® Systems

Our FAST Atomic Laye Process platform combines high-speed Plasma Enhanced ALD and Atomic Layer Etching in a single chamber — built around a dual-channel ceramic gas ring, dual-channel ceramic gas ring, chamber inside-wall protection, high speed pumping, customized gas box, optimized processes with our own Bipolar Electro-static Chuck.

  • Configurable for 150mm, 200mm, 300mm, 430mm wafer substrates
  • <3% SiO₂ & Al₂O₃ non-uniformity across 430mm substrate
  • Four-chamber scale-up available from Q4 2027
  • Delivered with advanced process monitoring equipment, measuring process performance every 10msec.
See the technology in depth
Comparison of ALD deposition uniformity across a wafer Comparison of ALD deposition uniformity across a wafer
Process Service

Contract Coating

Don't own a FALP tool yet? Send us your wafers. We run PEALD, ALE process sequences on your substrates inside our qualified cleanroom, using recipes we tune specifically to your film stack and feature geometry.

  • Al₂O₃, SiO₂, TiN and custom stack depositions
  • Si, Al₂O₃, SiO₂,,GaN, GaAs etc in-situ, etching.
  • High aspect-ratio (25–30) trench fill
  • Isotropic CD trimming and double-patterning services
  • NDA-protected handling for proprietary substrates
SEM cross-section image used for critical dimension measurement
Metrology

Analytics

Every wafer or substrate that we ship is backed by data. We perform customer specific processes and result qualification. Our in-situ process parameter monitoring on every 10msec interval provides assurance of stable and reliable execution. Our standard analytical service includes -

  • Ellipsometry Measurements
  • AFM Measurements
  • Optical Emission Spectroscopy measurements
  • Cold plasma measurements Etc.

The quality assessment of the processed substrate can be provided according to customer’s request which include XPS, TEM, SEM, SAW, EDX. XRD, XRR etc.

Flow dynamics simulation heatmap used in process consulting
Advisory

Process Consulting

We spent years solving the "impossible" problem of combining PEALD and ALE at speed in one chamber. That same flow-dynamics and plasma-chemistry expertise is available to help you solve your own process bottlenecks.

  • Feasibility studies for new film stacks or etch profiles
  • Gas-distribution and chamber-design simulation reviews
  • Recipe development and throughput optimisation
  • Technology transfer support for scaling pilot processes
Precision Parts

Contract Manufacturing of Spare Parts

The same ceramic Additive Manufacturing and precision-assembly expertise behind our gas distribution ring is available as a standalone service — for our own tools or your existing fleet.

Bipolar ESC
Lift Pins
Cover Ring
Bipolar ESC, lift pins and ceramic cover ring
  • Bipolar electrostatic chucks (ESCs)
  • Five times higher chucking force at the same voltage
  • Works with and without plasma
  • Zirconia (ZrO2) and alumina lift pins
  • Ceramic cover rings
  • Material: Al2O3
Availability

Wafer Sizes We Support Today

Whichever service you need, our chambers and metrology already cover these substrate sizes.

150-200mm
Standard wafer sizes
Available on Request
300mm
Standard wafer Size
Immediately Available
430mm
Large Substrate Size
Available on request
How We Work

A Straightforward Path to Production

1

Consultation

Tell us your film stack, substrate size and throughput target.

2

Feasibility & Recipe

We simulate flow dynamics and develop a tuned process recipe.

3

Pilot Run

Test wafers processed and measured in our ISO Class 5 clean room.

4

Production / Handover

Scale into contract coating, or take delivery of your own FALP® tool.

Not Sure Which Service Fits?

Tell us what you're trying to build or measure, and we'll point you to the right service — or the right combination of them.

Talk to Our Team View Open Roles